社團法人台灣平坦化應用技術協會
2024 CMP Forum 平坦化技術論壇

時間：2024年9月05日 8:00~12:00
地點：南港展覽館501會議室

科技專題> 
．Advanced Metrology Techniques for Through Glass Via (TGV) Charac-terization
．CMP Materials for Advanced Packaging Application
．Warpage and Stress Inspection Method for Grinded and Polished Wa-fer
．Advances in Micro-replicated Abrasives for Consistent CMP Perfor-mance
．Newly developed“5-inch”CMP diamond disk to improve the working efficiency and the uniformity of the polish pad surface roughness
．SiC Wafer Hybrid Machining Process
．Novel Integrated Approaches in CMP Metrology