[#31] - 徵才-Packaging Engineer

Packaging Engineer
Key Qualifications
10+ years’ experience in RF Design, Process and Material development.
RF package and module architecture, design, process and test experience.
Experience with the following packaging technologies for RF and Power products is strongly preferred: QFN, low loss organic laminate based multichip modules, embedded packages, copper pillar flip chip, gold wirebonding and 01005/0201 SMD.
Excellent mechanical and thermal simulation experience in IC level and system-level packaging, familiar with 3D CAD/CAE model and simulation software (Solidwroks, Pro-E, ANSYS APDL/workbench, Icepak, Fluent, Abaqus and Moldflow)
Experience with material characterization for mold compound, solder joint vicosplasicity, substrate/core, die attach film (DAF), PCB.
Hands-on experience with WiFi, Transceiver, LTE small cell and mobile RF PA module productization.
Prefer experience with RF amplifier packaging for GaAs HBT and/or FET/pHEMT
Excellent engineering problem solving with strong engineering physics.
Understanding of Power and Radio Frequency (RF) related packaging and materials concepts such as Loss & Q (in organic laminates, molding compounds, inductors and magnetics), thermal resistance, power density, RF coupling and grounding.
Excellent written and verbal communication and presentation skills.